Palladium Z2 Emulation enabled Microchip to achieve 1.5X faster run-time performance and 2X better emulation capacity SAN JOSE, Calif.— Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Microchip has deployed the Cadence® Palladium® Z2 Enterprise Emulation Platform for the development of their next generation ASIC products targeting high performance and … [Read more...]
New fanSINKS Cool Hot Components in Sizes from 27mm to 70mm
Advanced Thermal Solutions, Inc. (ATS) now provides fanSINKS™ heat sinks for component sizes ranging from 27mm to 70mm square. The wider size range accommodates hot semiconductor components, including FPGAs, ASICS and other package types used in telecomm, optics, test/measurement, military and other applications. ATS fanSINKS™ feature cross-cut, straight aluminum fins. They … [Read more...]
Bosch and Volkswagen Want to Industrialize Factory Equipment for Battery-Cell Production
Bosch and Volkswagen want to industrialize factory equipment for battery-cell production Bosch and Volkswagen aim to achieve cost and technology leadership in industrial-scale manufacturing processes for battery cells. Partners plan to provide state-of the-art manufacturing systems, digitalization solutions, as well as ramp-up and maintenance … [Read more...]
Panasonic Commercializes a Surface Mounted Automotive Power Communication Networking Equipment Inductor Capable of Passing Large Currents
Surface mounted inductors with a rated current of 30 to 70 A contribute to the enhanced performance and downsizing of automotive ECUs Osaka, Japan – Panasonic Corporation announced today that its Industry Company has commercialized a low-loss and high vibration-resistant surface mounted automotive power inductor [1] (PCC-M15A0MF series). This 15.6 mm square inductor meets … [Read more...]
A Polyimide Single-Component Silver Filled, Electrically Conductive Semiconductor Die-Attach Adhesive
Creative Materials introduces 122-47, a polyimide single-component silver filled, electrically conductive semiconductor die-attach adhesive. This product can be applied by stamping, screen printing, dipping and syringe dispensing, and is designed for die-attachment and surface mount applications. Other applications include assembling electrical and electronic components. The … [Read more...]
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