Fujipoly® introduces Sarcon® PG45A its newest high-performance, putty-like thermal interface material. This extremely low modulus gap filler exhibits a thermal resistance as low as 0.02°C•in2/W at 43.5 PSI with a thermal conductivity of 4.5 W/m°K. Sarcon® PG45A requires very low compression force at high compression rates making it a great choice for applications that have … [Read more...]
Fast Setting, Two Component Epoxy Color Coded for Proper Mixing
Master Bond EP51CC is a two component, fast setting epoxy with a color coding system where Part A is white and Part B is black. The two parts combine into a uniform gray color paste, which indicates proper mixing. This fast curing, non-drip compound is ideal for bonding and sealing applications with a forgiving mix ratio of one to one by weight or volume. This high … [Read more...]
Heat-Blocking Defects Detected Acoustically
In the landing gear control module of an aircraft, a high-voltage IGBT is about to fail. In the solder bonding one chip’s ceramic base to its heat sink are three small air bubbles—voids, in the vocabulary of electronic failures. The three voids are close together, and the largest is almost directly under a hot spot on the die. Collectively the voids have diminished … [Read more...]
Thermally Conductive Epoxy for Large Potting Applications Features Low Exotherm
Product: EP29LPAOHT Master Bond EP29LPAOHT is a two-component, NASA low outgassing approved epoxy system featuring a long working life of 8-10 hours per 1,000 gram batch. Due to its low exotherm and flowable consistency, this product is suitable for specialty potting applications where large masses of the epoxy need to be cured. It can be mixed and poured in … [Read more...]
Two-Component Room Temperature Curing Thermally Conductive And Electrically Insulating Adhesive
Ayer, MA, August 2020 New Product – Creative Materials introduces 813-76, a two-component room temperature curing thermally conductive and electrically insulating adhesive. This product is designed for assembling heat-sensitive components on printed circuit boards, and it develops strong adhesive bonds and excellent thermal transfer. 813-76 provides high impact bonds … [Read more...]
- « Previous Page
- 1
- …
- 21
- 22
- 23
- 24
- 25
- …
- 51
- Next Page »
