Master Bond EP4EN-80 is a NASA low outgassing approved epoxy, which can cure at temperatures as low as 80°C, unlike conventional one component heat curing systems. It features a quick cure profile at 65°C for 90 minutes plus 30 minutes at 80-85°C. The epoxy system requires no mixing prior to use, has a very low viscosity of 600-1,800 cps and contains no solvents. Free flowing … [Read more...]
Fast Curing, Silver Filled Epoxy Meets ISO 10993-5 Cytotoxicity Standards
Master Bond EP77M-FMed is a two part epoxy adhesive and sealant designed for use in the assembly of medical devices. It meets the ISO 10993-5 requirements and is not considered to have a cytotoxic effect. “This product has been formulated to provide excellent electrical and thermal conductivity properties, while keeping in mind processing constraints for heat sensitive … [Read more...]
New 8.0-Watt Thermal Putty
Fujipoly® introduces Sarcon® PG45A its newest high-performance, putty-like thermal interface material. This extremely low modulus gap filler exhibits a thermal resistance as low as 0.02°C•in2/W at 43.5 PSI with a thermal conductivity of 4.5 W/m°K. Sarcon® PG45A requires very low compression force at high compression rates making it a great choice for applications that have … [Read more...]
Fast Setting, Two Component Epoxy Color Coded for Proper Mixing
Master Bond EP51CC is a two component, fast setting epoxy with a color coding system where Part A is white and Part B is black. The two parts combine into a uniform gray color paste, which indicates proper mixing. This fast curing, non-drip compound is ideal for bonding and sealing applications with a forgiving mix ratio of one to one by weight or volume. This high … [Read more...]
Heat-Blocking Defects Detected Acoustically
In the landing gear control module of an aircraft, a high-voltage IGBT is about to fail. In the solder bonding one chip’s ceramic base to its heat sink are three small air bubbles—voids, in the vocabulary of electronic failures. The three voids are close together, and the largest is almost directly under a hot spot on the die. Collectively the voids have diminished … [Read more...]
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