Hybrid-electric and all-electric airplanes under study by NASA, such as the X-57 Maxwell, could operate more efficiently if the overall system was better at getting rid of heat. (Source: NASA) Future hybrid-electric and all-electric airplanes will use distributed electric propulsion (DEP), relying on multiple electric motors rather than a single or handful of jet fuel-based … [Read more...]
New Cooling Plate Said to Dramatically Increase the Lifetime of High Temperature Electronics
Korea Institute of Machinery & Materials is first to develop a TGP that operates in any direction, improving cooling efficiency by modifying the surface of a porous structure. During the past decade, developments in semiconductor industries have allowed electronics such as sensors and actuators to be miniaturized so as to perform effectively in a limited space. As a … [Read more...]
TC350 Plus Laminates for Higher Microwave & Industrial Heating Applications
Rogers Corp. has introduced TC350 Plus laminates. TC350 Plus laminates are ceramic filled PTFE-based woven glass reinforced composite materials providing a cost effective, high performance, thermally enhanced material for the circuit designer. With a thermal conductivity of 1.24W/mK, this next generation PTFE-based laminate is ideally suited for higher power microwave and … [Read more...]
New Diafilm TM220 from Element Six Offers Thermal Conductivity in Excess of 2200W/mK
At the 2019 International Microwave Symposium (IMS) Element Six, part of the De Beers Group, launched a new diamond thermal material grade designated Diafilm TM220. Said to be the world’s first diamond thermal material engineered to offer industrial users thermal conductivity in excess of 2200 W/mK, Diafilm TM220 was developed in response to the increasing demand for more … [Read more...]
Thermal Gap Filler Reduces Stress on Sensitive Components
Laird Performance Materials has introduced the Tflex HD80000, a high deflection thermal gap filler combining 6 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination allows minimal stress on sensitive components within a device while also yielding low thermal resistance. As a result, less mechanical and thermal stresses are … [Read more...]
- « Previous Page
- 1
- …
- 23
- 24
- 25
- 26
- 27
- …
- 51
- Next Page »
