Electronics Cooling invites you to share your expertise, knowledge, and perspective on critical aspects, foundational education, and trends with electronics thermal management technology. Electronics Cooling stands strong as one of the foremost resources for thermal management engineers and professionals, and much of this success is the result of a dedicated community of … [Read more...]
Rising Demand for Thermal Management in Consumer Electronics Prime Factor for Exponential Growth of Market
According to the new market research report "Thermal Management Market by Material Type (Adhesive, Non-Adhesive), Devices (Conduction, Convection, Advanced, Hybrid), Service (Installation & Calibration, Optimization & Post Sales), End-Use Application - Global Forecast to 2022", The thermal management market is expected to be worth USD 14.24 Billion by 2022, growing at a … [Read more...]
Avionics Thermal Management of Airborne Electronic Equipment, 50 Years Later
BACKGROUND In a proposal submitted to the Air Force in November of 1968, Collins Radio Company described ways to improve the electronic industry’s understanding of thermal management and predictive techniques [1]. This article briefly describes that proposal and discusses what aspects of electronics cooling have changed over the past five decades and what things have … [Read more...]
Application of Metallic TIMs for Harsh Environments and Non-flat Surfaces
Co-authored by: David L. Saums and Tim Jensen DS&A LLC and Indium Corporation INTRODUCTION Electronic systems, implemented in such diverse industries as aerospace, vehicle, geothermal exploration, and mobile devices with a range of more challenging application conditions, create new challenges for component and material reliability. Non-flat mounting conditions, … [Read more...]
New Laminates Introduced for 5G and Other Millimeter Wave Applications
Rogers Corporation is pleased to introduce CLTE-MW™ laminates. These laminates are ceramic filled, woven glass reinforced PTFE composites. CLTE-MW laminates were developed to provide a cost effective, high performance material for the circuit designer. This unique laminate system is well suited for applications that have limitations in thickness due to either physical or … [Read more...]
- « Previous Page
- 1
- …
- 28
- 29
- 30
- 31
- 32
- …
- 51
- Next Page »
