Tektronix Component Solutions’ new 30 GHz leadless chip carrier packaging platform meets the broadband performance requirements demanded by telecommunications systems and modules, military/aerospace applications, and terrestrial communications. Tektronix Component Solutions’ LCC platform is suitable for supporting demands for broadband (DC to 30 GHz), low pin-count ASIC … [Read more...]
Company Expands Data Center Capabilities with Acquisition
Legrand, North America recently announced the purchase of Electrorack Products Company, an American company specializing in cabinets, power and cooling solutions. The demand for cabinets and accessories in data centers, broadcast and broadband, industrial and military/aerospace/shipboard markets is expected to expand by 10% a year in the United States over the next few years, … [Read more...]
Electromagnetic, Thermal, Stress and Deformation Analysis of a Space-Based Satellite Dish Antenna
This paper presents a multiphysics analysis of a space-based communication satellite antenna. Electromagnetic losses due to induced high-frequency surface currents lead to partial, asymmetric heating of the structure, causing stress and deformation. A final electromagnetic analysis is performed on the resulting deformed structure to determine the effect of the deformation on … [Read more...]
Companies Construct Thermal Vacuum Test Facility
Dynavac, a manufacturer of space simulation and thin film deposition systems, has recently partnered with Matrix Service of Tulsa, Okla., to construct and install the GPS III Thermal Vacuum Test Facility at Lockheed Martin Space Systems Co.’s Waterton site in Littleton, Colo., a business unit of Lockheed Martin Corp., one of the largest U.S. aerospace companies. The … [Read more...]
Military Electronics Thermal Management Challenges Spark Innovation
Several trends are influencing thermal management in military and aerospace environments, including smaller electronic packages, components that fit into tighter spaces, and more powerful chips and IC packages. Packing more powerful components into smaller air-tight spaces creates major heat dissipation problems, an example of how size, weight, and power (SWaP) constraints … [Read more...]
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