The traditional pathway for development of thermal management technologies for electronics has been to analyze using heat transfer theory augmented by computational tools such as finite difference or finite element methods, CFD tools, or thermal management system simulation tools, sometimes in tandem with prototype system fabrication and testing. Combining recently available … [Read more...]
Hydraulic and Thermal Characteristics of a Double-Sided Cold Plate – Part 2
Tesla Tear Down, CFD Validation, and Machine Learning to Determine the Performance Limit This study investigates the hydraulic and thermal characteristics of the TESLA AUTOPILOT HW2.5 MODEL 3 Y, which features a double-sided cold plate with PCBs attached on both sides. We present a step-by-step teardown process of the unit, measuring internal dimensions, fin locations, … [Read more...]
A New Patented Approach to Diffusion Bonding Offers Speed and Improved Process Control
An innovative process is reducing diffusion bonding time of aluminum and aluminum alloys by up to 50%, energy use by 30%, and improving quality. Contract manufacturers and design engineers in the aerospace, semiconductor, high-power electronics, and energy industries have been turning to diffusion bonded metals to produce new cutting-edge innovations. Diffusion bonding is … [Read more...]
New Loctite Automotive Potting Solutions Ensure Outstanding Protection from Transmission Fluids, Thermal Shocks
Going the distance: Advanced automotive potting solutions from Henkel maintain electronic components’ performance, durability, and longevity As connected vehicles and autonomous driving functions become increasingly important to the driving experience, the reliability, durability, and performance of the underlying electronic components is fundamental. To ensure this, … [Read more...]
The Applicability of JESD51-14 for the Determination of Junction to Case Thermal Resistance
Rjc (or sometimes ThetaJC, θjc, Rth_jc), the so-called ‘junction to case’ thermal resistance, is a thermal metric that enables comparison of the thermal performance of packaged semiconductor devices from differing suppliers. The JEDEC standard JESD51-14 [1] documents a method for the experimental determination of Rjc. Although applicable for packages that exhibit a … [Read more...]
- 1
- 2
- 3
- …
- 46
- Next Page »
