INTRODUCTION The state of the art in performing thermal calculations in our industry is very advanced. However, how applicable the results of a calculation are to the real-world performance of a packaging or an active cooling component depends on the quality of the data characterizing these various components. In the real world of manufacturing, such characterization … [Read more...]
Beat the Heat in 3D Chip Stacks with Embedded Cooling
by: Pritish R. Parida, Mark Schultz & Timothy Chainer J. Watson Research Center, Yorktown Heights NY, USA INTRODUCTION In the Moore’s Law race to keep improving computer performance, the IT industry has turned upward, stacking chips like nano-sized 3D skyscrapers. But those stacks, like the law they’re challenging, have their limits, due to overheating. A solution … [Read more...]
Join the Electronics Cooling Community of Authors and Bloggers!
Electronics Cooling invites you to share your expertise, knowledge, and perspective on critical aspects, foundational education, and trends with electronics thermal management technology. Electronics Cooling stands strong as one of the foremost resources for thermal management engineers and professionals, and much of this success is the result of a dedicated community of … [Read more...]
Rising Demand for Thermal Management in Consumer Electronics Prime Factor for Exponential Growth of Market
According to the new market research report "Thermal Management Market by Material Type (Adhesive, Non-Adhesive), Devices (Conduction, Convection, Advanced, Hybrid), Service (Installation & Calibration, Optimization & Post Sales), End-Use Application - Global Forecast to 2022", The thermal management market is expected to be worth USD 14.24 Billion by 2022, growing at a … [Read more...]
New Thermoelectric Controllers for Precise Temperature Control
European Thermodynamics are pleased to announce the launch of the new JUNIOR and CyCLO pulse width modulator (PWM) thermoelectric controller electronic PCBs. Developed to work with the Adaptive® thermoelectric assemblies and thermoelectric cooler (TEC) modules, JUNIOR and CyCLO are thermoelectric controllers that enable a precise method of temperature control for sensitive … [Read more...]
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