Co-authored by: David L. Saums and Tim Jensen DS&A LLC and Indium Corporation INTRODUCTION Electronic systems, implemented in such diverse industries as aerospace, vehicle, geothermal exploration, and mobile devices with a range of more challenging application conditions, create new challenges for component and material reliability. Non-flat mounting conditions, … [Read more...]
Thermal Energy Harvesting with Next Generation Cooling for Automotive Electronics
Co-authored by: Feng Zhou, Shailesh N. Joshi, Ercan M. Dede Electronics Research Department, Toyota Research Institute of North America, 1555 Woodridge Ave., Ann Arbor, MI 48105, US INTRODUCTION In 2012, vehicle fuel-efficiency standards were announced that require all US cars and light trucks to reach 54.5 miles per gallon on average by model year 2025. As a result, … [Read more...]
Thermal Management of On-board Chargers in E-Vehicles
Electric vehicles are poised for a rapid growth phase with the combined effect of longer range, lower battery cost and faster charging rate. In particular, sales of plug-in electric vehicles (PEV) have tripled since 2013 and continue to grow at over 40% a year. It is expected that at these growth rates, 8 out of 10 new cars sold globally in 2030 will be a PEV. In some countries … [Read more...]
92ML™ StaCool™ Thermally Enhanced PCB Materials Manage Heat in Power Electronics Applications
Scott D. Kennedy Senior Product Manager Rogers Corp Power Electronics Design Trends Power electronics and associated thermal design is an essential early stage of many product development efforts, especially with growing demand for vehicular and industrial applications. Current trends to increase vehicular driver assistance features, reduce the carbon … [Read more...]
DuPont Launches New Portfolio of Electronic Thermal Management Solutions
DuPont Electronic Materials has recently announced the launch of a new portfolio of thermal solutions under the brand name DuPont™ Temprion™ thermal management materials. The Temprion™ portfolio is completely non-silicone and currently includes thermal greases, thermal gap fillers, electrically insulating films and adhesive thermal tapes. These new thermal management … [Read more...]
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