Scott D. Kennedy Senior Product Manager Rogers Corp Power Electronics Design Trends Power electronics and associated thermal design is an essential early stage of many product development efforts, especially with growing demand for vehicular and industrial applications. Current trends to increase vehicular driver assistance features, reduce the carbon … [Read more...]
DuPont Launches New Portfolio of Electronic Thermal Management Solutions
DuPont Electronic Materials has recently announced the launch of a new portfolio of thermal solutions under the brand name DuPont™ Temprion™ thermal management materials. The Temprion™ portfolio is completely non-silicone and currently includes thermal greases, thermal gap fillers, electrically insulating films and adhesive thermal tapes. These new thermal management … [Read more...]
Stainless Steel Heat Exchangers Highlighted at Upcoming Expo
Thermacore, Inc. will present its innovative stainless steel heat exchanger product offering at Pack Expo International on November 6-9 in booth E-7440 at McCormick Place in Chicago, Illinois. The standard material choice for heat exchangers used in food and beverage, medical equipment, and pharmaceutical industries is stainless steel. Corrosion-resistant stainless steel … [Read more...]
High-Performance Circuit Materials Exhibited at Upcoming Conference
Rogers Corporation will exhibit its high-performance circuit materials at the PCB West 2016 Conference and Exhibition, booth 201. Designed to dissipate heat in high-power applications, thermally enhanced 92ML laminates and prepregs are halogen-free, flame-retardant, thermally conductive epoxy-based thermoset materials that provide a lead-free-solder-compatible solution for … [Read more...]
Book Review of Electronics Cooling (2016)
by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Electronics cooling engineers and designers are used to one constant in their professional lives: change. Most of it (as far as problem solving is concerned) is change for the worse… and is challenging! The heat flux keeps increasing, the geometries keep shrinking, the available solution … [Read more...]
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