Thermacore, Inc. will present its innovative stainless steel heat exchanger product offering at Pack Expo International on November 6-9 in booth E-7440 at McCormick Place in Chicago, Illinois. The standard material choice for heat exchangers used in food and beverage, medical equipment, and pharmaceutical industries is stainless steel. Corrosion-resistant stainless steel … [Read more...]
High-Performance Circuit Materials Exhibited at Upcoming Conference
Rogers Corporation will exhibit its high-performance circuit materials at the PCB West 2016 Conference and Exhibition, booth 201. Designed to dissipate heat in high-power applications, thermally enhanced 92ML laminates and prepregs are halogen-free, flame-retardant, thermally conductive epoxy-based thermoset materials that provide a lead-free-solder-compatible solution for … [Read more...]
Book Review of Electronics Cooling (2016)
by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Electronics cooling engineers and designers are used to one constant in their professional lives: change. Most of it (as far as problem solving is concerned) is change for the worse… and is challenging! The heat flux keeps increasing, the geometries keep shrinking, the available solution … [Read more...]
Wide Array of Flow Switches Available
Sika offers a wide array of flow instruments, including flow switches. Flow switch options include the VK300 Flow Switch, Trimmable Paddle for Insertion, the VK300 Flow Switch for Copper Pipes, a Flow Switch for Pool & Spa Applications, a NSF61 Certified Flow Switch, VKX15, and more. … [Read more...]
Temporary Bonding Adhesive for Thin Wafer Handling Introduced
AI Technology has developed specialized tools and equipment to handle thin wafers and thin reconstituted wafers. A series of temporary bonding materials can process temperatures up to 150 Cº, and are well accepted for grinding, dicing, etching, and deposition. AIT’s high temperature wafer processing adhesives (WPA) handle higher temperature processing, and can withstand … [Read more...]
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