Rogers has announced that they can add data matrix codes (DMCs) to a wide range of metalized substrates, including direct-bonded-copper and active-metal-brazed substrates. The codes can be “text or numeric in form and encoded by code-reading camera systems” and “are written on metalized surfaces by means of a thin oxide layer formed by an optical laser system,” said the … [Read more...]
New Material Cools Solar Cells Yet Absorbs Sunlight
Recently, researchers from Stanford University have achieved a combination of cooling and maintaining sunlight absorption with a wafer made of silica to better cool solar cells, according to BusinessWire.com. BusinessWire.com explained, “The researchers etched tapered holes, about 6 micrometers across and 10 micrometers deep, in the wafer. The holes are designed to smooth the … [Read more...]
New USB Type-C Connectors and Cable Assemblies
Heilind Electronics has recently added Molex USB Type-C shielded I/O connectors and cable assemblies to its stock. The Type-C connectors offer a “more compact design” with “greater PCB savings, while allowing high-frequency mating in data, consumer, automotive, and industrial I/O applications,” according to Heilind. Heilind also said it’s “Type-C receptacles have a tongued … [Read more...]
Graphene Nanoflakes Better Dissipates Electronics’ Heat
(April 29, 2016) Recently, a team of researchers from Chalmers University of Technology in Sweden have developed a more efficient approach to cooling electronics using graphene nanoflake-based film. According to E&T, the team performed “experiments in which they managed to increase the efficiency of heat transfer by 76 per cent” – the kind of results that suggest … [Read more...]
Potential Electronics Cooling Application of Carbon Nanotubes
(April 21st, 2016) A technique has been found that could allow carbon nanotubes to be used in electronic cooling and as devices in microchips, sensors and circuits in the future. Phys.org reported that the technique “uses a laser and electrical current to precisely position and align carbon nanotubes” to make it a “potential new tool for creating electronic devices out of the … [Read more...]
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