Ford Global Technologies, a wholly-owned subsidiary of Ford Motor Company, has been assigned patent No. 8,246,422 for a “hybrid electric vehicle thermal management system.” According to the abstract of the patent published by the U.S. Patent and Trademark Office, “The [thermal management] systems [of the vehicle] determine a sunload and set calibrated thresholds and modified … [Read more...]
Nanotechnology Copper-Based Solder Material for Applications in Military and Commercial Systems
Scientists at the Lockheed Martin Space Systems Advanced Technology Center (ATC) in Palo Alto, California have developed CuantumFuse, a nanotechnology copper-based electrical interconnect material for applications in aerospace, military and commercial systems. According to the company, the creation of the new solder material is a result of an ongoing effort to phase out … [Read more...]
Thermoplastic Polyester for Thermal Management in LEDs and Electronic Components
Science-based company Royal DSM has released PET XL-T, a thermoplastic polyester for thermal management in LED lighting systems and automotive electronics components. According to the company, Arnite PET XL-T was developed as an alternative to metals and other high heat resistance (HHR) materials commonly used in automotive electronic applications. The new polyester is based … [Read more...]
Thin Cavity Fluidic Heat Exchanger
Third Millennium Engineering has released a Thin Cavity Fluidic Heat Exchanger, a small volume, high performance method for cooling critical electronic devices at the chip, board, module, and system levels. Its high thermal performance originates from a very high velocity air flow, a very thin boundary layer, and high air utilization. It can efficiently and reliably cool … [Read more...]
Silicon Carbide’s Potential in Hybrid and Electric Vehicles
Encouraged by silicon carbide’s superior material properties, major automotive manufacturers involved in developing hybrid and electric vehicles are currently testing SiC-based MOSFETs and other transistors as a viable alternative to silicon-based transistors, particularly for under-the-hood applications where the operating conditions are challenging. The wide-bandgap material … [Read more...]
- « Previous Page
- 1
- …
- 36
- 37
- 38
- 39
- 40
- …
- 46
- Next Page »