Authors: Jesse Galloway, Reliability and Thermal Engineer Consultant Robin Bornoff, Innovation Roadmap Manager ______________________________________________________________________________________________ Thermal characterization plays a vital role in electronic package reliability testing, design, and verification of manufacturing processes. The reliability of … [Read more...]
A Non-Contact Measurement Method for Thin Vapor Chambers by Photonic Technologies
Introduction In recent years, integrated circuit chips have enabled increasingly powerful computing capabilities as advanced process nodes have moved from DUV (deep ultra-violet) to EUV (extreme ultra-violet) lithography, allowing for higher fabrication resolution and transistor density. Additionally, advanced multi-die packaging has seen increased market demand. As a … [Read more...]
7 Most Common Myths About Heat Pipes
Overview Over many decades, Boyd has led innovation of superior heat pipe and two-phase thermal management solutions across many major industries from mobile and consumer electronics to NASA applications and next-generation enterprise and 5G equipment. We’ve observed many misconceptions about heat pipes, how they work, and how to best utilize them in applications while working … [Read more...]
Why Low Gassing Adhesives Matter
The aerospace, electronic, and optical industries often involve environments where outgassing from adhesives can pose significant challenges. When exposed to vacuum or elevated temperatures, conventional adhesives may release volatile compounds, leading to contamination or performance degradation of sensitive components. To mitigate these risks, engineers might consider low … [Read more...]
The Applicability of JESD51-14 for the Determination of Junction to Case Thermal Resistance
Rjc (or sometimes ThetaJC, θjc, Rth_jc), the so-called ‘junction to case’ thermal resistance, is a thermal metric that enables comparison of the thermal performance of packaged semiconductor devices from differing suppliers. The JEDEC standard JESD51-14 [1] documents a method for the experimental determination of Rjc. Although applicable for packages that exhibit a … [Read more...]
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