According to the new market research report "Thermal Management Market by Material Type (Adhesive, Non-Adhesive), Devices (Conduction, Convection, Advanced, Hybrid), Service (Installation & Calibration, Optimization & Post Sales), End-Use Application - Global Forecast to 2022", The thermal management market is expected to be worth USD 14.24 Billion by 2022, growing at a … [Read more...]
Thermally Conductive Laminate Material for Demanding PCB Applications
Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, has added to its extensive thermally conductive laminate and prepreg range with the launch of the VT-5A2, a next generation best-in-class, high Tg thin-core and prepreg material. VT-5A2 is designed for the world's most thermally demanding PCB (Printed … [Read more...]
Thermal Energy Harvesting with Next Generation Cooling for Automotive Electronics
Co-authored by: Feng Zhou, Shailesh N. Joshi, Ercan M. Dede Electronics Research Department, Toyota Research Institute of North America, 1555 Woodridge Ave., Ann Arbor, MI 48105, US INTRODUCTION In 2012, vehicle fuel-efficiency standards were announced that require all US cars and light trucks to reach 54.5 miles per gallon on average by model year 2025. As a result, … [Read more...]
Thermal Management and Safety Regulation of Smart Watches
ABSTRACT A smart watch is one of the most popular wearable devices now. Along with battery life and security, thermal safety is the most common concern. We show how to meet the ergonomic standards for users and predict thermal performance in typical scenarios. Thermal simulation software applied at the design stage can provide guidance on the use of heat spreading materials … [Read more...]
New Laminates Introduced for 5G and Other Millimeter Wave Applications
Rogers Corporation is pleased to introduce CLTE-MW™ laminates. These laminates are ceramic filled, woven glass reinforced PTFE composites. CLTE-MW laminates were developed to provide a cost effective, high performance material for the circuit designer. This unique laminate system is well suited for applications that have limitations in thickness due to either physical or … [Read more...]
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