Co-authored by: Nitesh Kumar Sardana, Susyamala Pavan Kumar Busam, Dr. Laxmidhar Biswal Robert Bosch Engineering and Business Solution Pvt. Ltd. Abstract The market demand for lightweight and cost effective electronic products with multi-functional operations leads to the introduction of plastic housing and high current density on board. In general, automotive electronic … [Read more...]
Laird Launches Active Transceiver Coolers for Optical Communications Market
Optimized thermoelectric-based Active Transceiver Coolers remove heat in remote radio units to enable higher data transmission speeds and lower latency in next generation communication networks… May 17, 2017 – Global technology leader Laird (LRD: London) has developed a new platform of customizable thermoelectric assemblies (TEAs) specifically designed for thermal … [Read more...]
Thermal Management – Enabled Products at CES 2017
The Consumer Electronics Show (CES) which concluded earlier this month is the largest annual conference and expo for anything or everything in electronics in the continental USA. By some estimates, CES 2017 exceeded the previous year record, topping 177K+ attendees. In such a large conference, enabling technologies like thermal management often take a backseat to the … [Read more...]
Inductive Wireless Charging is Now a Thermal Design Problem
Introduction: It is interesting how different parts of a value chain speak differently, sometimes wildly differently, about a product or feature but they may use the exact same words. For example, both the consumer and the thermal engineer want the device to have “cool” features. Wireless charging is one such hardware feature [1]. Wireless charging was included in over … [Read more...]
Book Review of Electronics Cooling (2016)
by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Electronics cooling engineers and designers are used to one constant in their professional lives: change. Most of it (as far as problem solving is concerned) is change for the worse… and is challenging! The heat flux keeps increasing, the geometries keep shrinking, the available solution … [Read more...]
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