A team of scientists from Lockheed Martin have produced a small satellite cooling system, the high power Microcryocooler, which is the lightest on the market and three times more powerful than the company’s first design. This design will pave the way for smaller and more compact IR sensor systems and novel sensor configurations. "The High Power Microcryocooler is making a … [Read more...]
Heat Exchangers Cool Electrical and Electronic Enclosures
EIC Solutions, a manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has released its HE series heat exchangers for cooling electrical and electronic enclosures. Ideal for cooling medical devices, food/beverage process controls, telecom equipment, computers, security equipment and other electronics and electrical devices housed in … [Read more...]
Thermoelectrically-Cooled Electronic Enclosure Line Expanded for More Applications
EIC Solutions, a manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has expanded its line of pre-packaged electronic enclosures with new sizes to meet more applications. Designed to protect and cool electronics and electrical devices, the Protector series pre-packaged enclosures combine several of EIC's standard cabinet sizes with … [Read more...]
New Fan Delivers High Static Pressure and Energy Reduction
Sanyo Denki Co., Ltd. has introduced the new San Ace 92 DC fan to its DC fan lineup. Measuring 92 × 92 × 38 mm, the new fan delivers the industry’s highest static pressure and energy reduction, the company says, offering cooling performance equivalent to that of three conventional products in series. The San Ace 92 9HV type is ideal for use in servers, data storage systems, … [Read more...]
Flexible Thermal Absorbing Films Boost Heat Dissipation in Small Electronics
Manufacturing company Henkel has released Loctite TAF, a new thermal absorbing film designed to address the heat management challenges associated with small but high-functioning handheld electronic devices. “Managing the intense heat generated by today’s handheld products is one of the biggest challenges facing device designers today,” Jonathan Rowntree, vice president of … [Read more...]
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