The selection of heat-spreader materials is an important consideration for cooling modules in handheld electronic systems. Heat spreaders are typically used in close contact with the source of heat. This can be, for example, a subcomponent, chip, or microelectronic package. The heat spreader transfers and distributes heat from the source to a heat sink through a thermal … [Read more...]
Setting the Standard for TIMs
Carteret, NJ —Tuesday, September 22, 2020— To accommodate diverse thermal cooling requirements, Fujipoly® offers (4) formulations of Standard Performance Gap Filler Pads. Each of the products in the SARCON® Standard Performance series have a different material construction in order to perfectly balance the performance demands of Thermal Conductivity, Thermal Resistance, Gap … [Read more...]
Microchip Introduces New 8-Channel Flashtec® PCIe® Gen 4 Enterprise NVMe™ SSD Controller
The Flashtec NVMe 3108 controller enables power and form-factor optimized enterprise NVMe SSDs with Flashtec’s trademark rich feature set and flexibility CHANDLER, Ariz., (GLOBE NEWSWIRE) -- As data centers support more Artificial Intelligence (AI) and Machine Learning (ML) workloads, there is a need for cloud scale infrastructure that provides more bandwidth to storage … [Read more...]
Neograf Solutions Introduces Next Generation Thermal Management Solutions For Electronics
NeoNxGen™ Single Layer Flexible Graphite Eliminates Cost, Complexity, and Reliability Issues of Multi-Layer Systems LAKEWOOD, OHIO USA - NeoGraf Solutions, a leading developer and manufacturer of high-performance natural and synthetic graphite sheets and powders, has launched NeoNxGen™ Thermal Management Solutions, a family of high-performance, thick, single layer … [Read more...]
Two-Component Room Temperature Curing Thermally Conductive And Electrically Insulating Adhesive
Ayer, MA, August 2020 New Product – Creative Materials introduces 813-76, a two-component room temperature curing thermally conductive and electrically insulating adhesive. This product is designed for assembling heat-sensitive components on printed circuit boards, and it develops strong adhesive bonds and excellent thermal transfer. 813-76 provides high impact bonds … [Read more...]
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