Product: EP21TPHT Release Date: 01/14/2020 Master Bond EP21TPHT is a new two component epoxy polysulfide system designed for bonding applications that require toughened and thermally stable bonds resistant to chemicals. It resists temperatures up to 350°F, much higher than typical epoxy polysulfide systems. This room temperature curable adhesive also features convenient … [Read more...]
Power-Rail Dissipation: Diverse Appearances, Unforeseen Consequences
One of the first practical lessons that electronic-circuit designer learn is to be aware of power-rail voltage drop, commonly called “IR drop,” which is the simple product of current and resistance in the printed-circuit board (PCB) track, wire, or larger cable. As currents increase to tens of amps and much higher, the IR-drop problem become more acute. Even a modest 50 mΩ of … [Read more...]
Underfill Epoxy Offers Thermal Conductivity and Electrical Insulation
Product: EP29LPTCHT Release Date: 11/21/2019 Master Bond EP29LPTCHT is a two component, low viscosity epoxy compound that can be effectively utilized for underfill and encapsulation applications. It does not need excessive heat for curing and has a long working life at room temperature. This system is electrically insulative and thermally conductive with very fine particle … [Read more...]
Low Compression Force Sarcon
Carteret, NJ — The compression characteristics of thermal gap fillers should be key considerations during a product’s early design phase. For applications that have delicate components or widely varying gap distances, Fujipoly® created a line of Low Compression Force gap filler pads. These TIMs help avoid overstressing the printed circuit board (PCB) and fragile solder joints … [Read more...]
Forced-Air Cooling: Should You Push or Pull?
As much as we’d prefer to be able to use just unforced, natural convection cooling, many designs and installations simply cannot be cooled adequately by the low level and uncertainty of airflow that this low-cost, reliable approach offers. Instead, it’s very common to use one or more fans to force the air at a known volume and velocity through the enclosure or chassis … [Read more...]
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