Master Bond has introduced EP46HT-1AO, a two-component, thermally conductive epoxy formulated for bonding and sealing applications in the aerospace, electronic and specialty OEM industries. EP46HT-1AO combines thermal conductivity and electrical insulation properties. This dimensionally stable system provides a tensile strength over 7,500 psi, a compressive strength of 26,000 … [Read more...]
Filter Fans Provide Effective Cooling for Electrical and Electronic Enclosures
EIC Solutions, Inc., a manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has introduced a new line of filter fans designed to remove unwanted heat from electrical/electronic enclosures and cabinets. The VFF series filter fans cool enclosures to a level slightly above the ambient temperature outside the cabinet by drawing filtered ambient … [Read more...]
Advances in Vapor Compression Electronics Cooling
INTRODUCTION Over the last 10 years, there has been a well-documented increase in the energy density of electronic devices. As this energy density has gone up, so has the heat dissipation on electronics packages. In response to this challenge, significant research has taken place to develop chip level cooling systems to meet heat fluxes in excess of 1000W/cm2. As stated … [Read more...]
Thermal Material Provides Both Compressibility and Conformability with Phase-Change Ability
AI Technology, Inc. has released COOL-PAD™ CPR7154, a thermal interface material that dispenses like a thermal pad but exhibits characteristics like that of a grease or gel when device temperatures increase to above 45°C. Ideal for use in LEDs, gaming consoles, laptops and desktop computers, COOL-PAD™ CPR7154 is optimized to accommodate large areas with different heights and … [Read more...]
Graphene Improves Copper Film Thermal Conductivity
The placement of a single atomic plane of graphene on the surface of a copper film can significantly increase the film’s thermal conductivity, making the hybrid material ideal for more demanding thermal management applications, according to new research from scientists at the University of Manchester, UK and the University of California-Riverside, U.S. The phenomenon was … [Read more...]
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