Ohmite Manufacturing, a provider of thermal solutions and resistors, has released its new B60/C60 heat sink system ideal for use with high power density and small size (3U or 4U) electronic packaging with forced convection. The new B60/C60 heat sink system provides designers with a variety of cooling options for up to six TO-246 or TO-264 devices, such as TO-247 and TO-264 … [Read more...]
Fansinks for High Temperature Applications
CTS Corporation has announced the release of new fansinks for high temperature applications. Designed to absorb and disperse heat away from high temperature devices, the FHS series features an operating temperature range of -10°C to 90°C, calculated MTTF @ 90°C: 86,858 hours (GEM, 90% confidence) and various package sizes to fit different applications. The FHS series is … [Read more...]
Research Could Lead to New Thermal Flow Control Devices
Researchers have proposed a new method of controlling heat flow similar to the way electronic components handle electrical current that could deliver more efficient thermal management in a variety of applications. Developed by scientists at Purdue University, the technology utilizes tiny triangular or T-shaped structures made of graphene nanoribbons to control phonons, quantum … [Read more...]
Carbon Nanotubes Boost Microprocessor Cooling
Researchers from the U.S. Department of Energy have developed a new technique that combines carbon nanotubes and organic materials to enable more efficient cooling of microprocessor chips. While carbon nanotubes have long been known to offer high thermal conductivity, widespread application in cooling systems has proven difficult because of their high thermal interface … [Read more...]
PCMA Thermal Interface for Intel Core LGA-115x Processors
Liquid cooling product manufacturer EK Water Blocks has released EK-TIM Indigo XS, a thermal interface material for Intel Core LGA-115x processors. Unlike greases, metallic thermal interface pads or liquid metal alloys, Indigo XS is a self-contained and sealed structure, deploying a phase-change metallic alloy (PCMA) which reflows and fills surface asperities on the CPU lid … [Read more...]
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