As electronic devices have grown smaller and more powerful, new thermal management methods have been created to help prevent them from overheating; however, researchers and engineers are in a constant race to come up with new methods to adequately manage the increasing amount of heat being generated by shrinking next-generation devices. Now, scientists at University of … [Read more...]
New Ultrathin Material May Lead to Better Thermally Conductive Coatings
Scientists at Kansas State University have discovered a new ultrathin electrically conductive material they say may lead to advances in the efficiency of electronic and thermal devices. Vikas Berry, the William H. Honstead professor of chemical engineering, and his colleagues found that manipulating molybdenum disulfide (MoS2)—a three-atom-thick inorganic compound … [Read more...]
Thermal Management of Many-Core Processors Using Power Multiplexing
Man Prakash Gupta and Satish Kumar G.W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology INTRODUCTION Due to the growing demands of higher performance and faster computing, the number of cores in a microprocessor chip has been increasing consistently. The transition from single core to multi-core technology has already been observed in the past few … [Read more...]
Use of JEDEC Thermal Metrics in Calculating Chip Temperatures (without Attached Heat Sinks)
Bruce Guenin Assoc. Technical Editor, Electronics Cooling INTRODUCTION JEDEC single-chip package thermal metrics are widely used as a means of characterizing the thermal performance of semiconductor packages. They correlate the peak temperature of a uniformly-heated semiconductor chip (the junction temperature, TJ) with the temperature of a specified region along the heat … [Read more...]
Hybrid Liquid-Air-Cooled Heat Sink for Extreme Environments
CoolClouds, Inc. has announced the availability of a new class of heat sinks for use in high performance computers or extreme environments starting mid-Q1 2014. According to the company, SuprCool-PC is the first “in-chassis” heat sink to cool more than 300w in the latest Intel and AMD processors without hot spots at 65°C case temperature in 25°C ambient. Comparable in size to … [Read more...]
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