Fan and blower manufacturer ebm papst has released the new AxiTop axial fan diffuser designed to help increase aerodynamic efficiency in fan systems. “The kinetic energy (velocity) at the exhaust of an axial impeller dissipates when the air is suddenly discharged into the surrounding environment,” the company explained. “The AxiTop diffuser is designed to recover this wasted … [Read more...]
'On-Demand' Nano-sized Heat Sinks Lower IC Temperatures
Scientists at RMIT University in Australia have released research that demonstrates a new method of heat dissipation on the nanoscale level. In a paper published in the online journal Advanced Energy Materials, Kourosh Kalantar-zadeh, a professor at the School of Electrical and Computer Engineering, and his colleagues demonstrate the “on-demand” creation of tiny nanofin heat … [Read more...]
Stamped CPU Heat Sink Cools High Power Components
Electronic components manufacturer ASSMANN WSW has released a new series of stamped CPU heat sinks for cooling pin grid arrays, ball grid arrays or other high power components. The series is available from distributor Rutronik. According to the company, the new CPU heat sinks offers an improve air convection of up to five percent because of non-simultaneous heating from one … [Read more...]
New Low Resistance TIM Delivers 6.0 W/m°K Thermal Conductivity
Thermal interface material provider Fujipoly has released Sarcon GR45A-00, a very low modulus thermal interface material with a low thermal resistance. Featuring a thermal conductivity of 6.0 W/m°K per ASTM D2326 (4.5 W/m°K per ISO/CD 22007-2 Hot disk) and a thermal resistance as low as 1.33°C cm2/W, the new formulation completely fills air gaps between components, board … [Read more...]
Multi-Purpose Cold Plates for TEC, LED and Semiconductor Cooling
Custom liquid cooling solutions provider Koolance has released three new multi-purpose cold plates for heat sources ranging from 25-50 mm/sq. The three models— PLT-UN50F, PLT-UN40F and PLT-UN25F—are ideal for thermal applications such as thermoelectric cooling, LEDs, image sensors and semiconductor cooling. PLT-UN50F features a cooling area footprint of 50mm x 50mm (1.97in x … [Read more...]
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