Mentor Graphics, a developer of electronic hardware and software design solutions, has announced FloTHERM XT, an electronics cooling simulation software package that enables “earlier virtual prototyping, fewer design iterations and advanced ‘what if’ analysis for improved product quality and faster time-to-market benefits.” According to Mentor Graphics, the new software is … [Read more...]
New Metal Oxide-Silicone Thermal Compound Offers Thermal Conductivity of 7.5W/mK
German power supplies manufacturer Be Quiet! Has released DC1, a new high performance thermal compound for critical cooling applications. According to the company, the new electrically non-conductive, metal oxide-silicone thermal compound features a “very high thermal conductivity of 7.5w/mK [that] provides exceptional heat transfer between chip and cooler” and is capable of … [Read more...]
Laptop Computer Smothered by Clothing Identified as Cause of House Fire
Officials have identified a laptop computer that was left running while sitting on top of a pile of clothes as the cause of a fire that destroyed a house in St. Raphael, Prince Edward Island, Canada earlier this week. "We believe that that laptop, at some point, got warm, and that heat then built up on that pile of clothes, and at some point ignited those clothes and that's … [Read more...]
“Golf Ball Dimple” Cooling Fans Added to Distribution Portfolio
Luso Electronics, a distributor of thermal management products, has announced the addition of Zaward Corporation’s patented “Golf Fan” products for thermal management in computing and industrial applications. According to Luso Electronics, the design for the new fans is based on “the dimpled surface of a golf ball” and “shows improved airflow and low noise at the same rotating … [Read more...]
New Magnetic Cooling Technology Decreases Environmental Impact of Cooling, Avoids Side Effects of Magnetic Fields on Electronics
Researchers from the University of Cambridge, U.K. and CIC nanoGUNE in Spain have developed a new cooling technology for the thermal management of computer chips and other miniaturized devices that utilizes materials that change their temperature when exposed to magnetic fields. Materials measuring only 20 nm tick and comprised of comprised of lanthanum, calcium, manganese and … [Read more...]
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