Cooler Master announced the Elite 120 Advanced MITX size chassis with 13-inches of graphics card space. A brushed aluminum front panel shelters a powerful 120mm fan intake, 80mm slim side fan, and additional support for a hard drive mounted 120mm fan. The case also has three 3.5-inch hard drives bays and a 5.25-inch optical bay. Learn more from Cooler Master … [Read more...]
Pre-Packaged Air Conditioned Enclosures for Electronics and Telecom Equipment
EIC Solutions, Inc. has introduced a new series of air conditioned electronic/electrical enclosures. The new Pre-packaged Protector Series enclosures feature rugged metal construction and a built-in thermoelectric air conditioner. The thermoelectric cooling unit does not use a compressor, refrigerant or filters, and there are no moving mechanical parts other than fans. EIC … [Read more...]
First Completely Passively-Cooled Graphics Card Developed
Colorful is the first manufacturer to develope a completely passive cooler for Nvidia's GeForce GTX 680 graphics card. Called the Colorful iGame GTX 680 Passive Edition, the card uses a completely silent cooling assembly for the 3.5 billion transistor GPU. The card itself is longer than most GTX 680 graphics cards in the market, with a large aluminum fin heat sink spanning its … [Read more...]
Computer Cabinet for Direct Cooling from its Base
MovinCool introduced its new Uptime Racks ECC13 air-conditioned computer cabinet. The cabinet system is manufactured by Computer Room Uptime and cooled by a MovinCool CM12 air conditioner that is built into the cabinet's base. The unit delivers 13,000 Btu/h of cooling capacity directly to the IT equipment housed in the cabinet, resulting in high energy efficiency. The cabinet … [Read more...]
Changes in Surface Texture Double Heat Dissipation
Researchers at MIT have found that relatively simple, microscale roughening of a surface can dramatically enhance its transfer of heat by more than doubling the maximum heat dissipation. To test the process, the researchers made a series of postage-stamp-sized silicon wafers with varying degrees of surface roughness. They found that systematically increasing roughness led to a … [Read more...]
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