The first commercially available computer system that is cooled with hot water rather than air was unveiled at the Leibniz Supercomputer Centre in Munich. The IBM iDataplex system removes heat 4,000 times more efficiently than air-cooled systems using a new form of IBM’s hot-water cooling technology. It cools active components in the system such as processors and memory modules … [Read more...]
Apple's New iPad Has Heat Problems
Heat-related issues may already be plaguing Apple’s new third-generation iPad. According to tests conducted by Consumer Reports, the new third-generation iPad measured approximately 12 to 13 degrees Fahrenheit warmer than the second-generation iPad. Consumers have also reported unauthorized “shut-downs” of their devices in warmer climates but thus far, no official statement … [Read more...]
Technical Brief: Design Considerations for High Performance Processor Liquid Cooled Cold Plates
The meteoric rise in cooling requirements of commercial computer products has been driven by an exponential increase in microprocessor performance over the last decade. The conventional way to cool microprocessors has been to utilize air to carry the heat away from the chip, and reject it to the ambient. Air cooled heat sinks are the most commonly used air-cooling devices with … [Read more...]
Calculation Corner: Transient Thermal Modeling of a High-Power IC Package, Part 1
Part II can be found here. There is an increasing need for calculating integrated circuit temperatures during conditions of changing chip power. Varying computer workloads and the implementation of power-saving strategies are leading to greater variability in chip power levels than in the past. As reliability requirements get more stringent there are growing concerns about the … [Read more...]
Breakthrough Thermal Material System to Enable Faster Computing
Scientists in GE’s Global Research Center have demonstrated an advanced thermal material system that could lead to faster computing and higher performing electronic systems. They have fabricated a prototype substrate that can cool electronic devices, such as a laptop, twice as well as copper. The development of GE’s prototype substrate, which utilizes phase-change-based heat … [Read more...]
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