Spire Corp. recently introduced its new high-end tower CPU cooler. Spire codenamed its newest thermal solution Gemini, the Zodiac sign for twins, due to the two towering dimpled fin heat-sinks. The increased number of heat-pipes combined with a higher number and density of dimpled fins and two high airflow fans provide extreme cooling performance. Six U-shaped 6mm heat-pipes … [Read more...]
New Laptop and iPad™ Cooling Products Introduced
ThermaPAK’s new products incorporate the company’s HeatShift Technology®, which brings down the temperature of long-running electronic devices to comfortable operating temperatures. The HeatShift Technology begins working once the gadget is placed on the pad. Grooved channels optimize airflow while eco-friendly salt crystals absorb the heat from a laptop or iPad™, for example, … [Read more...]
Computers that Recycle Energy among Top IT Innovations
Computers that can recycle energy are among the scenarios IBM Corp. predicts over the next five years as part of its annual “Next Five in Five” year-end innovations report based on technologies being developed in IBM labs and around the world. On-chip water-cooling systems could be used to utilize thermal energy from a cluster of computer processors to provide hot water for an … [Read more...]
Feds Could Save $1 Trillion with Smarter Tech and Practices
The federal government could save as much as a cool $1 trillion by 2020 by embracing several IT efforts such as virtualization and cloud computing, according to newly released report from the Technology CEO Council. In a report titled “One Trillion Reasons,” the IT industry advocacy group outlines seven broad initiatives that it says would be better suited to address the … [Read more...]
Making Sure Your Chips Don’t Burn
Researchers at the Tyndall National Institute at University College Cork in Ireland have found a new way of cooling semiconductors in computers, mobiles and games consoles to improve their performance and reduce energy consumption. Most computers have thermal interface materials (TIM) to join the chip with the heat sink, with solder or a thin, film-like sheet. Solder is … [Read more...]
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