A research team from the A*STAR Institute of Microelectronics and Nanyang University in Singapore has designed and built a water circulation system to cool stacks of integrated electrical circuits. “The heat must be removed from microchips to maintain a temperature within acceptable limits: less than 100 °C,” explains team-member Navas Khan from the Institute of … [Read more...]
Intel® Atom™ Processor-Based Platform Uses Significantly Lower Power
Intel Corporation has unveiled its newest Intel® Atom™ processor-based platform. The technology package provides significantly lower power consumption and prepares the company to target a range of computing devices, including high-end smartphones, tablets and other mobile handheld products. The platform has been repartitioned to include the Intel Atom processor Z6xx, which … [Read more...]
ElectronicsCooling Spring 2010 Print Issue
Did you miss us? For those of you that are faithful readers of Electronics Cooling, we are pleased to inform you that after a short interval of restructuring, we have resumed publication. Given the recent downturn in the economy as a whole, and specifically within the electronics thermal management community, we can hope that this is a sign of improvement and recovery. We will … [Read more...]
Thermally Conductive Printed Circuit Board Substrate
Laird Technologies, Inc. recently announced the release of its enhanced Tlam™ SS LLD for use as a thermally conductive printed circuit board (PCB) substrate. The Tlam SS LLD is a versatile, thermally enhanced PCB substrate system specifically designed for heat dissipation in bright and ultra-bright LED module applications. The thermally conductive PCB substrate provides 8-10 … [Read more...]
Researchers Cool Down Supercomputers with Warm Water
A team of IBM researchers in Switzerland is experimenting with a micro network of copper tubes that run through smaller, clustered computer servers and whisk away heat with the help of warm water. Liquid cooling, even with warm water, is 4,000 times more effective than air cooling at removing heat, they say. Researchers from IBM and the Swiss Federal Institute of Technology in … [Read more...]
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