Fujipoly® America announces the release of its new SARCON® SPG-70A. It is a high flow rate, high heat transferring compound that exhibits a thermal conductivity of 7.0 W/m°K and has the lowest thermal resistance among our dispensable SPG products. When applied between heat-generating components and a nearby heat sink or spreader, the form stable thermal material completely … [Read more...]
Thermal Adhesive Tape with Extremely Low Thermal Resistance Reflects Synergistic Innovation Between DuPont and its Laird Performance Materials Acquisition
The Laird™ Ttape™ 1000A thermally conductive adhesive tape delivers best-in-class thermal resistance WILMINGTON, Del., June 3, 2022 - Laird Performance Materials, part of DuPont Interconnect Solutions, has capitalized on collaborative innovation with DuPont to introduce Laird™ Ttape™ 1000A thermally conductive adhesive tape, a standalone 50µm adhesive that offers extremely … [Read more...]
Thermally Optimizing a High-Power PCB for Battery Powered Electronics
Introduction The growth of battery powered applications is presenting new challenges for designers of electronic motor-driven solutions. Targeting higher performance and efficiency, the power stages of these products must manage high currents while meeting strict power dissipation and size requirements. This article illustrates a thermally aware workflow with Cadence® Celsius™ … [Read more...]
Arieca Announces $6.5M Series A Funding Round
Company will use the investment to accelerate product development and scale up manufacturing of its Liquid Metal-based thermal interface materials (TIMs). May 17, 2022 8:00 AM Eastern Daylight Time PITTSBURGH--(BUSINESS WIRE)--Arieca Inc., the leader in liquid-metal based thermal interface materials for high performance computing and high power semiconductor devices, … [Read more...]
Why Chemical Compatibility Is Vital To Your Liquid Cooling System
Power densities in electronic subsystems continue to increase, driving demand for more extreme cooling power alternatives that increasingly include liquid cooling as a viable candidate. To optimize thermal management efficiency, sustainability and reliability, designers of systems that use liquid cooling are exploring innovative combinations of component materials, including … [Read more...]
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