Master Bond MasterSil 153AO is an addition cured two-part silicone with a self-priming property. It has a high tensile lap shear strength, especially for a silicone. The system is thermally conductive and electrically insulating. “The key feature of MasterSil 153AO is that it provides the ability to minimize stress, with no compromise on strength. Although it is not considered … [Read more...]
Nextreme™ Performance Chillers Offer Energy Savings up to 50%
Easy-to-use, eco-friendly recirculating chiller offers low noise performance in laboratory settings... March 31, 2021 – Modern laboratory equipment requires precise cooling to protect electronics or to control processes where temperature matters. Laird Thermal Systems’ Nextreme™ Performance Chiller Series offers reliable, precise, and versatile temperature control solutions … [Read more...]
CoolIT Celebrates 20th Anniversary with Revenue Milestone and Strong Market Position
Accelerated Market Adoption of Direct Liquid Cooling and Key Partnerships Lead to Another Bright Year Ahead. CALGARY, Alberta, April 6, 2021 /PRNewswire-PRWeb/ -- CoolIT Systems, the global leader in scalable direct liquid cooling technology (DLC) for desktop and data centers systems with over 4 million coldplate solutions shipped to date, has reached a significant business … [Read more...]
New High-Temperature Thermoelectric Coolers from Laird Thermal Systems Cool Optical Sensors in Advanced Driver-Assistance Systems (ADAS)
High-temperature autonomous systems require active cooling to ensure proper, long life performance… March 11, 2021 – Advanced driver-assistance systems (ADAS) use a variety of imaging sensors, cameras and lasers to enhance vehicle safety and create better driving conditions. Most of these optical devices, including CMOS sensors and laser diodes, are heat sensitive and rely on … [Read more...]
One Part Fast Curing Epoxy for Bonding and Small Encapsulation Applications
Master Bond EP4EN-80 is a NASA low outgassing approved epoxy, which can cure at temperatures as low as 80°C, unlike conventional one component heat curing systems. It features a quick cure profile at 65°C for 90 minutes plus 30 minutes at 80-85°C. The epoxy system requires no mixing prior to use, has a very low viscosity of 600-1,800 cps and contains no solvents. Free flowing … [Read more...]
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