THOUSAND OAKS, Calif. and ARLINGTON, Va. – January 4, 2021 – Teledyne Technologies Incorporated (NYSE:TDY) (“Teledyne”) and FLIR Systems, Inc. (NASDAQ:FLIR) (“FLIR”) jointly announced today that they have entered into a definitive agreement under which Teledyne will acquire FLIR in a cash and stock transaction valued at approximately $8.0 billion. Under the terms of … [Read more...]
New Tflex SF10 Silicone-free Gap Filler Delivers 10 W/mk Thermal Conductivity, Excellent Deflection Properties
CLEVELAND, Ohio – February 26, 2021 – Laird Performance Materials continues to focus on innovation with its release of its Tflex™ SF10 Series, a silicone-free gap filler delivering 10 W/mk thermal conductivity along with low deflection properties enabling it to exert minimal pressure on delicate components. Along with no silicone and its high thermal conductivity, a key … [Read more...]
Orion Fans Launches IP69K Rated Fans in AC and DC Versions
IP69K rated fans lower the total cost of ownership by reducing maintenance requirements and equipment downtime... DALLAS, TX (February 09, 2021) - Orion Fans has expanded its IP69K rated fans to include both AC and DC versions. Designed for applications that must withstand high temperature and high pressure washdown with water and cleaning chemicals, the IP69K rating offers … [Read more...]
Case Study: Numerical Prediction for Thermal Management of Battery Packs with Cloud-based CFD
Electronics are becoming smaller and smaller and the requirement to dissipate heat is constantly growing. The lack of an efficient thermal management strategy can lead to low performance, energy inefficiency, system failure, and even serious damage. With numerical simulation, such strategies can be tested early in the design process. This article shows how to use this … [Read more...]
Precision-Clad Composite Materials for Heat Spreaders in Handheld Electronics
The selection of heat-spreader materials is an important consideration for cooling modules in handheld electronic systems. Heat spreaders are typically used in close contact with the source of heat. This can be, for example, a subcomponent, chip, or microelectronic package. The heat spreader transfers and distributes heat from the source to a heat sink through a thermal … [Read more...]
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