DuPont Electronic Materials has recently announced the launch of a new portfolio of thermal solutions under the brand name DuPont™ Temprion™ thermal management materials. The Temprion™ portfolio is completely non-silicone and currently includes thermal greases, thermal gap fillers, electrically insulating films and adhesive thermal tapes. These new thermal management … [Read more...]
New Registration Process Makes Requesting Samples & Quotes Faster
Fujipoly has created an online suite of features that allow engineers to request free samples and/or quotes with the click of a mouse. The registration process takes under 2 minutes to complete and even allows users to create default shipping and billing locations. The “Request a Sample” feature guides engineers to the product by using drop-down menus to specify Sarcon® … [Read more...]
Electronics Cooling of Humans!
by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Earlier in August of this year, Electronics Cooling featured an article on energy efficiency of data centers where a review of the energy consumed by the IT and non-IT equipment and its optimization by deterministic (DCIM) and AI methods (Google’s Deepmind) was presented. The … [Read more...]
Surface Temperatures of Electronics Products: Appliances vs. Wearables
by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Prior to designing the requisite thermal management solution, engineers routinely calculate the junction temperatures of active and passive components using various methods at their disposal –finite difference grids, lumped parameter models, finite element methods, etc. The junction … [Read more...]
Book Review of Electronics Cooling (2016)
by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Electronics cooling engineers and designers are used to one constant in their professional lives: change. Most of it (as far as problem solving is concerned) is change for the worse… and is challenging! The heat flux keeps increasing, the geometries keep shrinking, the available solution … [Read more...]
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