A startup called Akhan Semi suggests lab-grown diamonds can cool electronics more efficiently than silicon. Silicon costs a lot to keep cool, but lab-grown diamonds could eliminate cooling fans and heat sinks since they already eliminate 90% of the energy lost by silicon, according to Adam Khan, founder and CEO of Akhan Semi, the diamond-making startup. “Because a … [Read more...]
Overcoming Cooling Challenges Downloadable Webinar Now Available
The recent Electronics Cooling with Autodesk CFD Webinar on how to ensure proper cooling as the electronics used in products change and improve is now available for download. Exploring ‘invisible elements’ like airflow and heat transfer, speaker Jim Byrne talks through how to maximize product performance by overcoming common electronics challenges like reduction in product … [Read more...]
Registration for Thermal Conference Opens
ITherm 2016 has now opened registration for the conference running from May 31 to June 3, 2016 at the Cosmopolitan Hotel in Las Vegas, Nevada. ITherm 2016 is the leading international conference for scientific and engineering exploration of thermal, thermo-mechanical and emerging technology issues associated with electronic devices, packages, and systems. According to the … [Read more...]
New 2D Semiconductor Performs Better Than Silicon
A team of engineers from the University of Utah have discovered a new 2D semiconducting material that could outperform silicon, making electronics cooler and more efficient. “The semiconductor, made of the elements tin and oxygen, or tin monoxide (SnO), is a layer of 2D material only one atom thick, allowing electrical charges to move through it much faster than conventional … [Read more...]
Higher Temperature Rated MLC Capacitors Announced
Knowles brand, Dielectric Laboratories (DLI), has taken temperature performance to a level of 175°C in their Ultra-low ESR and High Q MLC capacitors. DLI detailed the following: “UL is an EIA Class I Stable TC, NP0, Ceramic dielectric, with Ultra Low ESR; High Q, and Low Noise. Parts can now be operated up to +175°C with TCC of 0 ± 60 ppm/ºC (limited to +125°C at 0 ± 30 … [Read more...]
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