Four engineering students at MIT have developed a thermoelectric bracelet designed to help wearers maintain a comfortable body temperature. Resembling a wristwatch, the invention, known as Wristify, monitors air and skin temperature and sends pulses of hot or cold waveforms to the wrist when needed to help the wearer maintain thermal comfort. A custom copper-alloy-based heat … [Read more...]
Sony Releases Source Code for Thermal Management Solution
Consumer electronics provider Sony has released the source code for Thermanager, a thermal management solution developed for and used in the company’s Android Open Source Project (AOSP) for Xperia projects. The source code is available through the Sony channel on GitHub. “Since the first release of Android Open Source Project (AOSP) for Xperia devices, thermal management for … [Read more...]
Waterproof Tablet Computer Features Cooling Fan
Electronics manufacturer Fujitsu has released a unique new tablet computer capable of operating underwater while using a cooling fan to pump heat away from sensitive internal circuitry. The Arrows Tab QH77/M is 2-in-1 computer that can be used both as a clamshell notebook computer and as a tablet computer when the display unit is detached. The casing houses an Intel Core … [Read more...]
New PMIC Reduces Thermal Stress in Processors
High performance analog IC and sensor provider ams AG has introduced the AS3721, a power management IC (PMIC) with an innovative remote-feedback circuit designed to help reduce the thermal stress of applications processors in smartphones and tablets. When paired with ams’ new AS3729 point-of-load regulators, AS3721 provides a complete power management system that offers a fast … [Read more...]
Material Solutions for High-Frequency, High-Thermal-Reliability and Multilayer Circuits
Rogers Corporation, a manufacturer of specialty materials and components that enable high performance and reliability of consumer electronics, power electronics and telecommunications infrastructure, will be featuring its new high-Dk RO4360G2 laminate and 2929 bondply materials at the PCB West 2013 conference and exhibition Sept. 25, 2013 in Santa Clara, Calif. According to … [Read more...]
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