In the earliest days of personal computing, excess heat wasn’t a problem; any heat that was generated by the computer dissipated safely into the surrounding air. Even in the 1980s, a single fan was all that was needed to ventilate the entire inside case of the computer. However, as faster computer processors continued to develop, fans were no longer enough to maintain an ideal … [Read more...]
Thin Cavity Fluidic Heat Exchanger
Third Millennium Engineering has released a Thin Cavity Fluidic Heat Exchanger, a small volume, high performance method for cooling critical electronic devices at the chip, board, module, and system levels. Its high thermal performance originates from a very high velocity air flow, a very thin boundary layer, and high air utilization. It can efficiently and reliably cool … [Read more...]
Pre-Packaged Air Conditioned Enclosures for Electronics and Telecom Equipment
EIC Solutions, Inc. has introduced a new series of air conditioned electronic/electrical enclosures. The new Pre-packaged Protector Series enclosures feature rugged metal construction and a built-in thermoelectric air conditioner. The thermoelectric cooling unit does not use a compressor, refrigerant or filters, and there are no moving mechanical parts other than fans. EIC … [Read more...]
Computer Heat Sink Company Licenses Fan-less Cooler Technology
Sandia National Laboratories announced that their Sandia Cooling technology has been licensed by two companies, bringing the Sandia Cooler heat sink much closer to the production phase. According to the company, the redesigned architecture for the air-cooled heat exchanger "simultaneously eliminates all three drawbacks of conventional air-cooled heat exchanger … [Read more...]
Changes in Surface Texture Double Heat Dissipation
Researchers at MIT have found that relatively simple, microscale roughening of a surface can dramatically enhance its transfer of heat by more than doubling the maximum heat dissipation. To test the process, the researchers made a series of postage-stamp-sized silicon wafers with varying degrees of surface roughness. They found that systematically increasing roughness led to a … [Read more...]
- « Previous Page
- 1
- …
- 46
- 47
- 48
- 49
- 50
- …
- 53
- Next Page »
