Introduction Traditional handbook-based reliability prediction methods for electronic products include Mil-Hdbk-217, Telcordia SR-332 (formerly Bellcore), PRISM, FIDES, CNET/RDF (European), and the Chinese GJB-299. These methods rely on analysis of failure data collected from the field and assume that the components of a system have inherent constant failure rates that are … [Read more...]
LED Thermal Standardization: A Hot Topic
Introduction The main topic of the article is how to cope with the increasing need for standardization of thermal characterization of LEDs (Light Emitting Diodes) and LED-based products (see Fig.1 showing a typical LED package). The LED-business is growing much faster than analysts predicted five years ago. Unfortunately, the progress in thermal characterization has not kept … [Read more...]
Numerical Simulation of Complex Submicron Devices
Introduction Significant increases in temperature are believed to contribute to losses in reliability and performance, and can present serious complications to thermal management. The net thermal effect depends on a combination of factors related to the feature size, power densities, and material properties. In semiconductor devices, higher heat flux densities can result from … [Read more...]
Cooling of a Flat TV Monitor
Thermal design in the consumer electronics business is about dealing with two difficult challenges: The first is to fulfill, and if possible surpass, customer expectations. The second is to do this in ever shortening design cycles. After a main initial use of flat displays as computer monitors, larger flat display screens are now emerging for video purposes: the Flat TV. … [Read more...]
Thermal management of handheld telecommunication products
Introduction Recent advances in mobile communications have enabled large scale development of handheld telecommunication products. Such products include cellular phones, pagers, two-way radios, personal digital assistants (PDAs), and other wireless and wireline equipment. The technological enhancements at device, package, and system levels have resulted in increased … [Read more...]
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