Since the size of electronic components keeps on decreasing, the need for improved heat dissipation on these components keeps increasing. This dichotomy presents thermal engineers with a formidable challenge: how to design smaller coolers that dissipate more heat. Adding to the challenge, the fast-paced evolution of electronics means that the development time for the new cooler … [Read more...]
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity
In this video demonstration, learn more about EP3HTSDA-1, a thermally conductive die attach epoxy, and see how easily it dispenses. One component Master Bond EP3HTSDA-1 is formulated primarily for die attach applications. It exhibits a die shear strength of 20-22 kg-f and has a high thermal conductivity of 40-45 BTU•in/ft2•hr•°F [5.7-6.5 W/(m•K)]. “This 100% solids … [Read more...]
Statistic Corner: Comparing Populations
Introduction Previous articles in this series described the normal distribution and how it is used to relate probability and confidence levels [1, 2]. A practical application of the use of the confidence interval was to describe how to determine the range of values in which the true mean of a population falls within, based on the mean and standard deviation calculated from a … [Read more...]
Future Trends in LED Driver System Modeling
Introduction A decade ago, the major players in the lighting industry decided to make the transition to digital systems and set the pace in connected lighting. At present, only a few companies can maintain their leadership. As a self-fulfilling prophecy, the lighting landscape changed remarkably, with scattered competitors having access to internet of things (IoT) ecosystems … [Read more...]
Upper Air Room Disinfection with UV-C Luminaire – Metrics and Multi-Domain Modeling Approach
In my previous article, I questioned how our simulation community of experts can contribute in this pandemic time? I am coming back to present examples of contributions. While the general topic of this article is outside the typical scope of Electronics Cooling Magazine, it does illustrate how analysis methods that are discussed here, such as computational fluid dynamics, and … [Read more...]
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