Introduction In recent years, integrated circuit chips have enabled increasingly powerful computing capabilities as advanced process nodes have moved from DUV (deep ultra-violet) to EUV (extreme ultra-violet) lithography, allowing for higher fabrication resolution and transistor density. Additionally, advanced multi-die packaging has seen increased market demand. As a … [Read more...]
Liquid Cooling Takes Center Stage at OpenCompute Summit 2024
OCP Global Summit started this week in San Jose and as to be expected, two topics are getting all the attention –AI Compute and Liquid Cooling. Apart from these two, co-packaged optics (CPO) is another topic that has garnered much interest this year at the summit. As for liquid cooling, the market adoption has been primarily in using facility water via coolant distribution … [Read more...]
Power Density In the Context of Two-Phase Immersion Cooling
Abstract Data centers face challenges in balancing space and power, with studies showing that when power density exceeds 7kW per rack, IT equipment space utilization drops to 50%. Traditional cooling methods are reaching limits due to increasing demands from deep learning and AI, necessitating more space. Two-phase immersion cooling offers simplicity and cost savings … [Read more...]
Tech Brief: Radiation Basics: When Does It Matter?
Introduction This is the first installment in a series of articles that aim to explore a range of practical topics on radiation that will be relevant to those of us focused on electronics cooling and thermal design. While radiation is one of the three fundamental modes of heat transfer, it is often the last topic covered in an introductory heat transfer course. This may … [Read more...]
Design Considerations for Chip/Package Level Bare Die Impingement Cooling for High Performance Computation Systems
Introduction of Bare-Die Jet Cooling in Package With the rising demand for more powerful, efficient, high-performance computation (HPC) systems, power densities of devices have increased dramatically. To cope with the increasing heat flux challenge for future data center servers beyond 1 kW/cm2, efficient liquid cooling solutions are needed to address those thermal … [Read more...]
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