By Serdar Ozguc, Qingyang Wang, Akshith Narayanan, Richard W. Bonner III The Need for Two-Phase Cooling in Data Centers Power usage in data centers account for 1.8% of the overall electricity expenditure in the United States [1] and the cooling infrastructures make up 50% of the total energy consumption of the data centers [2]. Power consumption translates to high … [Read more...]
Choosing the Right Liquid Cooling Quick Disconnects — Key Considerations for Optimal Thermal Management
By Cameron Koller, Marketing Development Manager, Parker Hannifin Quick Coupling Division As technology evolves, one challenge remains constant: heat. Servers, supercomputers, and data centers generate massive amounts of heat, with power densities often reaching 10 to 20 kilowatts per rack and, in some cases, significantly exceeding 50 kW in high-performance computing … [Read more...]
Augmenting Development of Electronics Cooling Technologies with Machine Learning Tools – a Heat Pipe System Example
The traditional pathway for development of thermal management technologies for electronics has been to analyze using heat transfer theory augmented by computational tools such as finite difference or finite element methods, CFD tools, or thermal management system simulation tools, sometimes in tandem with prototype system fabrication and testing. Combining recently available … [Read more...]
Pfannenberg USA Introduces PTF 1200 High CFM Top-Mounted Filter Fan
Lancaster, NY – Pfannenberg, Inc., a global leader in thermal management and signaling technologies, proudly introduces the PTF 1200, an industry leading high CFM top-mounted filter fan designed to redefine cooling solutions for various industries. This compact yet powerful innovation boasts an unimpeded airflow rate of up to 589 CFM, making it a game-changer in the realm of … [Read more...]
A Non-Contact Measurement Method for Thin Vapor Chambers by Photonic Technologies
Introduction In recent years, integrated circuit chips have enabled increasingly powerful computing capabilities as advanced process nodes have moved from DUV (deep ultra-violet) to EUV (extreme ultra-violet) lithography, allowing for higher fabrication resolution and transistor density. Additionally, advanced multi-die packaging has seen increased market demand. As a … [Read more...]
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