Master Bond MasterSil 153AO is an addition cured two-part silicone with a self-priming property. It has a high tensile lap shear strength, especially for a silicone. The system is thermally conductive and electrically insulating. “The key feature of MasterSil 153AO is that it provides the ability to minimize stress, with no compromise on strength. Although it is not considered … [Read more...]
Nextreme™ Performance Chillers Offer Energy Savings up to 50%
Easy-to-use, eco-friendly recirculating chiller offers low noise performance in laboratory settings... March 31, 2021 – Modern laboratory equipment requires precise cooling to protect electronics or to control processes where temperature matters. Laird Thermal Systems’ Nextreme™ Performance Chiller Series offers reliable, precise, and versatile temperature control solutions … [Read more...]
One Part Fast Curing Epoxy for Bonding and Small Encapsulation Applications
Master Bond EP4EN-80 is a NASA low outgassing approved epoxy, which can cure at temperatures as low as 80°C, unlike conventional one component heat curing systems. It features a quick cure profile at 65°C for 90 minutes plus 30 minutes at 80-85°C. The epoxy system requires no mixing prior to use, has a very low viscosity of 600-1,800 cps and contains no solvents. Free flowing … [Read more...]
New Tflex SF10 Silicone-free Gap Filler Delivers 10 W/mk Thermal Conductivity, Excellent Deflection Properties
CLEVELAND, Ohio – February 26, 2021 – Laird Performance Materials continues to focus on innovation with its release of its Tflex™ SF10 Series, a silicone-free gap filler delivering 10 W/mk thermal conductivity along with low deflection properties enabling it to exert minimal pressure on delicate components. Along with no silicone and its high thermal conductivity, a key … [Read more...]
CoolIT Systems Continued Leadership in Advanced Data Center Cooling Showcased at SC20
CoolIT launches several new products to further support data center leaders Calgary, Alberta. November 18th, 2020 – CoolIT Systems, the global leader in scalable direct liquid cooling technology (DLC) for desktop and data center systems, announces multiple new product developments and launches at Supercomputing 2020. As the leading liquid cooling integration partner for … [Read more...]
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