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In the data center, power and cooling costs more than the it equipment it supports

 

Historically, the cost of energy and the cost of the data center power and cooling infrastructure have not been on the radar for most Chief Financial Officers (CFO) and Chief Information Officers (CIO) and have not been considered in TCO (Total Cost of Ownership) models. As a result, almost all of the focus has been on driving down the cost of IT equipment in the data center. … [Read more...]

Liquid Cooling Of A High-Density Computer Cluster

 

Introduction Recent advances in computer clusters have resulted in the introduction of higher density server equipment that consumes significant amounts of electrical power and produces an extraordinary amount of heat. Due to this latter attribute, which has alarming consequences with regard to thermal management, the installation of modern computer clusters will require … [Read more...]

Thermal Design And NEBS Compliance

 

Introduction As part of contractual and design requirements, telecom equipment destined for certain networks in the North American market has to be tested to the Network Equipment Building System (NEBS) standard and comply with its requirements. NEBS is a standard from Telcordia, formerly known as Bell Communication Research (Bellcore). Technically speaking, NEBS is the … [Read more...]

Liquid Cooling is Back

 

Introduction IBM announced its return to water cooling on April 19, 2005 with the introduction of a water cooled heat exchanger mounted to the back cover of a 19 inch rack. This is the first of the major datacom equipment manufacturers to employ water cooling for a rack of CMOS processors, using a cooling distribution unit supplying the water and rejecting the heat load to … [Read more...]

Review of Low Profile Cold Plate Technology for High Density Servers

 

Introduction Water cooling of computers was introduced more than twenty years ago, but had disappeared from the mainstream by the mid 1990s. The conversion of chip technology from bipolar to CMOS (complementary metal oxide semiconductor) was the main reason. As chip powers continue to increase, water cooling appears likely to become mainstream again. In the current market, the … [Read more...]

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