Most engineers involved with temperature measurement know there are several methods for measuring temperatures of fluids and solids. The oldest and most common method for measuring the temperature of a fluid such as air is the standard mercury-in-glass thermometer. However, this is not acceptable for measuring surface temperatures of solid objects. For surface temperature … [Read more...]
Augmenting Development of Electronics Cooling Technologies with Machine Learning Tools – a Heat Pipe System Example
The traditional pathway for development of thermal management technologies for electronics has been to analyze using heat transfer theory augmented by computational tools such as finite difference or finite element methods, CFD tools, or thermal management system simulation tools, sometimes in tandem with prototype system fabrication and testing. Combining recently available … [Read more...]
Thermal Analysis Methodology Best Practices
Thermal analysis: It’s a field that every mechanical engineer is exposed to during their undergraduate studies and many dabble in at some point during their professional careers. It’s also a field that some devote their full-time careers to as dedicated thermal engineers (or thermal analysts). Regardless of where in the broad spectrum of mechanical engineering work scope you … [Read more...]
New Loctite Automotive Potting Solutions Ensure Outstanding Protection from Transmission Fluids, Thermal Shocks
Going the distance: Advanced automotive potting solutions from Henkel maintain electronic components’ performance, durability, and longevity As connected vehicles and autonomous driving functions become increasingly important to the driving experience, the reliability, durability, and performance of the underlying electronic components is fundamental. To ensure this, … [Read more...]
The Applicability of JESD51-14 for the Determination of Junction to Case Thermal Resistance
Rjc (or sometimes ThetaJC, θjc, Rth_jc), the so-called ‘junction to case’ thermal resistance, is a thermal metric that enables comparison of the thermal performance of packaged semiconductor devices from differing suppliers. The JEDEC standard JESD51-14 [1] documents a method for the experimental determination of Rjc. Although applicable for packages that exhibit a … [Read more...]
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