European Thermodynamics are pleased to announce the launch of the new JUNIOR and CyCLO pulse width modulator (PWM) thermoelectric controller electronic PCBs. Developed to work with the Adaptive® thermoelectric assemblies and thermoelectric cooler (TEC) modules, JUNIOR and CyCLO are thermoelectric controllers that enable a precise method of temperature control for sensitive … [Read more...]
Application of Metallic TIMs for Harsh Environments and Non-flat Surfaces
Co-authored by: David L. Saums and Tim Jensen DS&A LLC and Indium Corporation INTRODUCTION Electronic systems, implemented in such diverse industries as aerospace, vehicle, geothermal exploration, and mobile devices with a range of more challenging application conditions, create new challenges for component and material reliability. Non-flat mounting conditions, … [Read more...]
New Laminates Introduced for 5G and Other Millimeter Wave Applications
Rogers Corporation is pleased to introduce CLTE-MW™ laminates. These laminates are ceramic filled, woven glass reinforced PTFE composites. CLTE-MW laminates were developed to provide a cost effective, high performance material for the circuit designer. This unique laminate system is well suited for applications that have limitations in thickness due to either physical or … [Read more...]
Case Study: Thermal Design and Analysis of a Combat-Ready Electronics Unit
INTRODUCTION Militaries continue to expand their use of electronics in harsh environments while preserving an absolute minimal risk of failure. In this regard, effort spent early in the design process on concept development, parametric and trade-off studies, and simulation-driven design can yield amplified benefits in terms of product performance and reliability, reduced … [Read more...]
Book Review of Electronics Cooling (2016)
by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Electronics cooling engineers and designers are used to one constant in their professional lives: change. Most of it (as far as problem solving is concerned) is change for the worse… and is challenging! The heat flux keeps increasing, the geometries keep shrinking, the available solution … [Read more...]
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