JARO has recently released their newest Micro-Fan available with 0.60cfm. The fan measures 17x17x4 mm (at 15,000rpm), and offers a static pressure of 2.413 mm H2O, according to JARO. With operating voltages from 2.8 to 3.5Vdc, the life expectancy is 50,000 hours. It is ideal for space-limited applications, including UAVs (Unmanned-Aerial-Vehicles), pocket projectors, PDA, … [Read more...]
New Availability of Data Matrix Codes (DMCs)
Rogers has announced that they can add data matrix codes (DMCs) to a wide range of metalized substrates, including direct-bonded-copper and active-metal-brazed substrates. The codes can be “text or numeric in form and encoded by code-reading camera systems” and “are written on metalized surfaces by means of a thin oxide layer formed by an optical laser system,” said the … [Read more...]
Graphene Nanoflakes Better Dissipates Electronics’ Heat
(April 29, 2016) Recently, a team of researchers from Chalmers University of Technology in Sweden have developed a more efficient approach to cooling electronics using graphene nanoflake-based film. According to E&T, the team performed “experiments in which they managed to increase the efficiency of heat transfer by 76 per cent” – the kind of results that suggest … [Read more...]
Potential Electronics Cooling Application of Carbon Nanotubes
(April 21st, 2016) A technique has been found that could allow carbon nanotubes to be used in electronic cooling and as devices in microchips, sensors and circuits in the future. Phys.org reported that the technique “uses a laser and electrical current to precisely position and align carbon nanotubes” to make it a “potential new tool for creating electronic devices out of the … [Read more...]
New Market Entry of Sealed Enclosure Coolers
As their “first step” into the sealed enclosure cooling market, Advanced Cooling Technologies (ACT) has recently launched its HSC, HPC and LNC series of sealed enclosure cooler products. ACT said this about each of their new products: “ACT’s HSC series of coolers are based on a patent pending design that utilizes the air impingement technology that is thermally efficient and … [Read more...]
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