The Parker Aerospace business segment of Parker Hannifin Corp., which specializes in single-phase liquid and two-phase liquid/vapor thermal management products and systems, has been awarded a contract to provide the thermal management system to Kongsberg Defense Systems for its Joint Strike Missile. Funded by the Norwegian government, the Joint Strike Missile is expected to be … [Read more...]
New Method Combines Gallium Nitride and Diamond for Better Thermal Management of Amplifiers
A demonstration of what is considered to be the first-ever gallium nitride (GaN)-on-diamond high electron mobility transistor could significantly reduce thermal resistance and increase RF performance in monolithic microwave integrated circuit (MMIC) power amplifiers, DARPA said in a statement. While MMIC power amplifiers equipped with gallium nitride transistors hold the … [Read more...]
Thermoelectric Air Conditioner for Use in Mobile Military and Defense Applications
Thermoelectric air conditioner manufacturer EIC Solutions, Inc. has released the ThermoTEC 145 series 1500 BTU military-grade air conditioner for use in transit cases for mobile military and defense applications. According to Jamie Alletag, EIC Solutions sales engineer, the rugged 145 series military-grade cooler’s auto ranging feature makes the units completely functional in … [Read more...]
Three-Dimensional Chip-Cooling Technology Could Multiply Heat Removal Tenfold
Researchers from the Georgia Institute of Technology in Atlanta, Ga. have been awarded a $2.9 million Defense Advanced Research Projects Agency (DARPA) contract to develop three-dimensional chip-cooling technology capable of dissipating up to 10 times the amount of heat currently removed by cooling systems used today. The new technology will also need to successfully manage … [Read more...]
DARPA Releases Request for Industry Assistance in Developing New Cooling Techniques
The U.S. Defense Advanced Research Projects Agency (DARPA) has released a formal request to industry for assistance in the development of new electronics cooling techniques for use in military embedded systems and radio frequency monolithic microwave integrated circuit (MMIC) power amplifiers. The request comes as part of the Intrachip/Interchip Enhanced Cooling (ICECool) … [Read more...]
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