Automobiles, military vehicles, even large-scale power generating facilities may someday operate far more efficiently thanks to a new alloy developed at the U.S. Department of Energy’s Ames Laboratory. A team of researchers at the Lab that is jointly funded by the DOE Office of Basic Energy Sciences, Division of Materials Sciences and Engineering and the Defense Advanced … [Read more...]
Thermal Gap Filler Wins Editor's Choice Award
The Tflex™ XS400 Series thermal gap filler won Military Embedded Systems Magazine’s Editor’s Choice award for November/December. The Tflex™ XS400 Series received the award for its commercial, off-the-shelf (COTS) properties, which makes it well-suited for military defense applications. Tflex™ XS400 is a compliant elastomer gap filler designed to provide moderate thermal … [Read more...]
Company Expands Data Center Capabilities with Acquisition
Legrand, North America recently announced the purchase of Electrorack Products Company, an American company specializing in cabinets, power and cooling solutions. The demand for cabinets and accessories in data centers, broadcast and broadband, industrial and military/aerospace/shipboard markets is expected to expand by 10% a year in the United States over the next few years, … [Read more...]
New Small Form Factor Conduction Cooled Chassis
Curtiss-Wright Controls Electronic Systems has introduced a new, rugged 6-slot 3U OpenVPX (or 7-slot 3U CompactPCI) conduction cooled chassis for harsh military environments. The SFF-6 Small Form Factor Chassis is the newest member of Electronic Systems’ Hybricon® family of advanced military COTS electronic packaging solutions and features the company’s CoolWall™ thermal … [Read more...]
Military Electronics Thermal Management Challenges Spark Innovation
Several trends are influencing thermal management in military and aerospace environments, including smaller electronic packages, components that fit into tighter spaces, and more powerful chips and IC packages. Packing more powerful components into smaller air-tight spaces creates major heat dissipation problems, an example of how size, weight, and power (SWaP) constraints … [Read more...]
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