Aitech Defense Systems Inc. now offers the NightHawk RCU, a rugged, compact Intel Atom-based, self-contained control unit that weighs only 4.5 pounds. The weight reduction, combined with a slim profile and natural convection/radiation cooling that dissipates up to 22 W at +55°C in stagnant (non-flowing) air, or at up to 71°C with an optional low pressure fan or baseplate, makes … [Read more...]
Direct Spray Cooling and System-level Comparisons
Introduction As power densities of embedded electronics increase, cooling becomes a challenge especially in harsh environments. Liquid cooling is accepted as an attractive cooling method for an increasing number of applications. Direct spray is a particularly efficient form of liquid cooling that has recently been included on several manned and unmanned military platforms. This … [Read more...]
LED Thermal Standardization: A Hot Topic
Introduction The main topic of the article is how to cope with the increasing need for standardization of thermal characterization of LEDs (Light Emitting Diodes) and LED-based products (see Fig.1 showing a typical LED package). The LED-business is growing much faster than analysts predicted five years ago. Unfortunately, the progress in thermal characterization has not kept … [Read more...]
Health Assessment and Prognostics of Electronic Products: An Alternative to Traditional Reliability Prediction Methods
Introduction Traditional handbook-based reliability prediction methods for electronic products include Mil-Hdbk-217, Telcordia SR-332 (formerly Bellcore), PRISM, FIDES, CNET/RDF (European), and the Chinese GJB-299. These methods rely on analysis of failure data collected from the field and assume that the components of a system have inherent constant failure rates that are … [Read more...]
Numerical Simulation of Complex Submicron Devices
Introduction Significant increases in temperature are believed to contribute to losses in reliability and performance, and can present serious complications to thermal management. The net thermal effect depends on a combination of factors related to the feature size, power densities, and material properties. In semiconductor devices, higher heat flux densities can result from … [Read more...]
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