Lancaster, NY – Pfannenberg, Inc., a global leader in thermal management and signaling technologies, proudly introduces the PTF 1200, an industry leading high CFM top-mounted filter fan designed to redefine cooling solutions for various industries. This compact yet powerful innovation boasts an unimpeded airflow rate of up to 589 CFM, making it a game-changer in the realm of … [Read more...]
7 Most Common Myths About Heat Pipes
Overview Over many decades, Boyd has led innovation of superior heat pipe and two-phase thermal management solutions across many major industries from mobile and consumer electronics to NASA applications and next-generation enterprise and 5G equipment. We’ve observed many misconceptions about heat pipes, how they work, and how to best utilize them in applications while working … [Read more...]
New Loctite Automotive Potting Solutions Ensure Outstanding Protection from Transmission Fluids, Thermal Shocks
Going the distance: Advanced automotive potting solutions from Henkel maintain electronic components’ performance, durability, and longevity As connected vehicles and autonomous driving functions become increasingly important to the driving experience, the reliability, durability, and performance of the underlying electronic components is fundamental. To ensure this, … [Read more...]
Baltimore Aircoil Company Highlights Customized Data Center Cooling Solutions
Jessup, MD – Baltimore Aircoil Company (BAC), the global leader in modular cooling equipment, highlights its cooling solutions ideal for data center applications. Data centers use a dense network of computing and storage that enable the processing and delivery of applications and data for organizations. Mitigating heat and humidity is a leading concern around data center … [Read more...]
The Applicability of JESD51-14 for the Determination of Junction to Case Thermal Resistance
Rjc (or sometimes ThetaJC, θjc, Rth_jc), the so-called ‘junction to case’ thermal resistance, is a thermal metric that enables comparison of the thermal performance of packaged semiconductor devices from differing suppliers. The JEDEC standard JESD51-14 [1] documents a method for the experimental determination of Rjc. Although applicable for packages that exhibit a … [Read more...]
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