KYOCERA Introduces New Thermoelectric Module for High-Performance Heating, Cooling Applications Supports extreme thermal-management requirements for COVID-19 investigation, PCR testing, high-performance batteries, and more. San Diego – July 21, 2020 – Kyocera International, Inc. today introduced a compact, highly reliable thermoelectric cooling module specifically … [Read more...]
Pfannenberg USA Introduces Pfannenberg’s Kinetic System™ Series Air to Air Heat Exchangers
Next Generation Environmentally-Friendly Technology Cools Electrical Enclosures, Keeps Dust Out Lancaster, NY — A typical air-to-air heat exchanger creates a path that allows heat to move from a higher to lower temperature more quickly than cooling can occur within an enclosure wall. In contrast, Pfannenberg’s Kinetic System™ (PKS) Series Air to Air Heat Exchangers create a … [Read more...]
Solder Joint Lifetime of Rapidly Cycled LED Components
Reprinted from the June, 2014 Issue ACTIVE LEDs in a consumer TV product are boosted and dimmed with the video picture content. Boosting and dimming of LEDs is a powerful means to improve visual experience, either through the application of active LEDs in an ambient light feature or through dimming and boosting of the display LEDs in a direct-lit video display. Active … [Read more...]
Underfill Epoxy Offers Thermal Conductivity and Electrical Insulation
Product: EP29LPTCHT Release Date: 11/21/2019 Master Bond EP29LPTCHT is a two component, low viscosity epoxy compound that can be effectively utilized for underfill and encapsulation applications. It does not need excessive heat for curing and has a long working life at room temperature. This system is electrically insulative and thermally conductive with very fine particle … [Read more...]
Laird Introduces IceKap™ P30000, a Novel, Non-Silicone, High Performance Thermal Interface Material for Lidded and Non-lidded Device Applications
Improving Thermal Performance and Device Reliability September 5, 2019 – Cleveland, Ohio, USA – Laird Performance Materials, a global manufacturer enabling and protecting sensitive electronics, has introduced IceKap™ P30000, a silicone-free, high performance thermal interface material (TIM) which takes advantage of a new polymer … [Read more...]
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