Scott D. Kennedy Senior Product Manager Rogers Corp Power Electronics Design Trends Power electronics and associated thermal design is an essential early stage of many product development efforts, especially with growing demand for vehicular and industrial applications. Current trends to increase vehicular driver assistance features, reduce the carbon … [Read more...]
Book Review of Electronics Cooling (2016)
by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Electronics cooling engineers and designers are used to one constant in their professional lives: change. Most of it (as far as problem solving is concerned) is change for the worse… and is challenging! The heat flux keeps increasing, the geometries keep shrinking, the available solution … [Read more...]
Thermal Conductivity & CTE of Materials: Can We Engineer Them?
by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Most electronics cooling problems are not just limited to the computation of temperatures at various points and the design remedies thereof. They also extend to managing the collateral effects of temperature fluctuations. One such effect is the mobilization of thermomechanical stresses in … [Read more...]
Wide Array of Flow Switches Available
Sika offers a wide array of flow instruments, including flow switches. Flow switch options include the VK300 Flow Switch, Trimmable Paddle for Insertion, the VK300 Flow Switch for Copper Pipes, a Flow Switch for Pool & Spa Applications, a NSF61 Certified Flow Switch, VKX15, and more. … [Read more...]
Temporary Bonding Adhesive for Thin Wafer Handling Introduced
AI Technology has developed specialized tools and equipment to handle thin wafers and thin reconstituted wafers. A series of temporary bonding materials can process temperatures up to 150 Cº, and are well accepted for grinding, dicing, etching, and deposition. AIT’s high temperature wafer processing adhesives (WPA) handle higher temperature processing, and can withstand … [Read more...]
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