Researchers at Germany’s Fraunhofer Institute of Solar Energy Systems have developed highly-porous metal organic frameworks (MOFs) that can be applied in a thin layer to efficiently absorb large quantities of water vapor. MOFs, as determined by research published in RSC Advances, are three-dimensional porous structures consisting of metallic clusters and organic linkers adept … [Read more...]
Adhesive Cures at Temperatures as Low as 60°C
DELO, a manufacturer of industrial adhesives for automotive, consumer and industrial electronics applications, has released a new heat-curing adhesive that cures to full strength in temperatures as low at 60°C. The new DELOMONOPOX LT204 epoxy resin minimizes thermal stress and warping of components being bonded, making it ideal for optical packaging and other applications where … [Read more...]
New Device to Cool Chips at the Micro-Scale
Researchers at the University of California, Berkeley and the University of California, San Diego have developed a novel evaporator structure that can be integrated directly into electronics to cool chips with micro-sized components. “The idea behind this project is to use liquid, in this case de-ionized water, to absorb the heat produced by any kind of device, then evaporate … [Read more...]
Thermal Adhesive Tape Reduces PCB Production Time
Universal Science, a provider of thermal management solutions, has introduced a reflowable, thermally conductive adhesive tape designed for application during PCB manufacturing. Bondline 1000-Reflow can be laminated directly to PCBs prior to processing, enabling the PCBs to be finished/ supplied with a thermally conductive, mechanical fixing tape pre-applied and thus reducing … [Read more...]
Syringe-Packaged Greases Satisfy Electrical and Thermal Conductivity Needs
Intertronics now offers CircuitWorks’ syringe-packaged conductive greases, which provide electric and/or thermal conductivity for a range of applications. CircuitWorks’ new silicone-free heat sink grease will not harden or dry out while offering excellent thermal conductivity and dielectric properties. It is non-corrosive and exceeds ML-C-47113 for thermal conductivity, … [Read more...]
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