EIC Solutions, a manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has released its HE series heat exchangers for cooling electrical and electronic enclosures. Ideal for cooling medical devices, food/beverage process controls, telecom equipment, computers, security equipment and other electronics and electrical devices housed in … [Read more...]
Non-Silicone Thermal Pad Offers Natural Tack, Good Insulation
Tglobal Technology Co., Ltd. has released its new PC94 non-silicone thermally conductive pad. Ideal for electronic component, heat sink, LED and other thermal applications, the new soft pad features an acryl base, natural tack and good insulation with a thermal conductivity of 4 W/m-K, working temperature of -40°C to 105°C and tensile strength of 2 Kgf/mm2. … [Read more...]
Magnetic Refrigeration Could Replace Compressor Systems
Researchers working in GE labs have used special magnetic materials to generate temperatures cold enough to freeze water in a breakthrough that could find its way into commercial refrigerators by the end of the decade. (Video: General Electric). Researchers at General Electric have unveiled a new refrigerant system utilizing special magnetic materials that could be up to 20 … [Read more...]
Thermoelectrically-Cooled Electronic Enclosure Line Expanded for More Applications
EIC Solutions, a manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has expanded its line of pre-packaged electronic enclosures with new sizes to meet more applications. Designed to protect and cool electronics and electrical devices, the Protector series pre-packaged enclosures combine several of EIC's standard cabinet sizes with … [Read more...]
Heat Sink Series Provides Modular Cooling Options for Electrical Components
Ohmite Manufacturing, a provider of thermal solutions and resistors, has released its new B60/C60 heat sink system ideal for use with high power density and small size (3U or 4U) electronic packaging with forced convection. The new B60/C60 heat sink system provides designers with a variety of cooling options for up to six TO-246 or TO-264 devices, such as TO-247 and TO-264 … [Read more...]
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