Sanyo Denki Co., Ltd. has introduced the new San Ace 92 DC fan to its DC fan lineup. Measuring 92 × 92 × 38 mm, the new fan delivers the industry’s highest static pressure and energy reduction, the company says, offering cooling performance equivalent to that of three conventional products in series. The San Ace 92 9HV type is ideal for use in servers, data storage systems, … [Read more...]
Highly-Conformable Gap Filler Pad with Reinforced Mesh Center
Fujipoly America Corporation has released its new Sarcon25GR-T2d thermal interface material, a soft, highly-conformable gap filler pad with a reinforced mesh center ideal for applications that require a thermal interface bridge across larger surface areas. Once installed, the TIM delivers a thermal conductivity of 1.5 W/m°K per ASTM D2326 and a thermal resistance of 0.40 … [Read more...]
Carbon Nanotubes Offer Thermal Stress Relief at Critical Juntions
Scientists at Stanford University have released new findings that demonstrate the benefits of using carbon nanotube arrays at critical junctions between two materials to help better relieve thermal stress. Thermal stress, often caused by the joining of two materials that expand and contract at different rates as temperatures change, can lead to unnecessary strain and … [Read more...]
Boron Nitride Filler for Thermally Conductive Dielectric Plastic Compounds
Saint-Gobain Ceramic Materials has released its new CarboTherm boron nitride thermal management fillers for use in thermally conductive, dielectric plastic compounds. The new boron nitride fillers will be on display December 10-11 at the Compounding World Forum 2013 in Philadelphia, Penn., USA. “Boron nitride, unlike other ceramics, is soft and non-abrading, enabling longer … [Read more...]
New Dispensable Thermal Pads Offer Improved Heat Management, Greater Application Potential
Dow Corning, a developer of silicon-based technology, has introduced new Dow Corning Dispensable Thermal Pads for use in LED, data server, telecommunications equipment and transportation thermal management applications. “Compared to traditional fabricated thermal pads, new Dow Corning Dispensable Thermal Pads offer the potential for broader design latitudes, simplified … [Read more...]
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